Self-developed Lead Scan is one of the core equipment in the semiconductor packaging and testing process. Lead Scan is used after chip packaging is completed, where it performs measurement and defect inspection of the package exterior using optical imaging technology. It is compatible with a wide range of package types, including but not limited to BGA, CSP, QFP, QFN, and LGA. The equipment integrates cutting-edge technologies in the machine vision industry, including high-speed positioning and handling, high-precision 2D/3D optical modules, PICS semiconductor-specific software, and AI-based deep learning. It enables comprehensive quantitative analysis of key parameters—such as package warpage, coplanarity, and lead geometry—and captures and classifies defects in finished chips.